Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Contact I-line exposure
Material Arch OiR 897-10i
Proximity
Separation of mask and wafer (separation of 0 um indicates contact)
 0 µm
Setup time 30 min
Sides processed either
Wavelength
Wavelength of light used during the exposure
 365 nm
Wafer size
Wafer size
Equipment Karl Suss MA6 Mask Aligner
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
 vacuum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
 300 .. 2000 µm