Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Application of adhesion promoter (A-174 Silane)
Sides processed both
Wafer size
Wafer size
Equipment Parylene deposition system
Equipment characteristics:
Batch sizes 100 mm: 3
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, no-flat, notched
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 ceramic, Foturan (Schott), glass (category), Pyrex (Corning 7740), quartz (fused silica), silicon, silicon on insulator, stainless steel
Wafer thickness
List or range of wafer thicknesses the tool can accept
 300 .. 500 µm