Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  Resist hardening
Batch size 4
Pressure
Pressure of process chamber during processing
 760 Torr
Process duration 75 min
Sides processed either
Temperature 110 °C
Wafer size
Wafer size
Equipment UV Harden
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
 plate
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon, silicon germanium, silicon on insulator, quartz (single crystal)
Wafer thickness
List or range of wafer thicknesses the tool can accept
 300 .. 700 µm
Comments:
  • Photoresist hardening must be performed before etching in AMT 8100 to avoid resist burning.