Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  Stylus profilometer step measurement
Contact force
Force applied at contact point
 0.01 .. 0.4 mN
Depth 100 µm
Measurement unit angstrom, micron
Sides processed either
Wafer size
Wafer size
Equipment Tencor Alpha Surface profilometer
Equipment characteristics:
Batch sizes 50 .. 150 mm: 1
MOS clean no
Piece dimension
Range of wafer piece dimensions the equipment can accept
 2 .. 150 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
 circular, irregular, other, rectangular, triangular shard
Piece thickness
Range of wafer piece thickness the equipment can accept
 200 .. 1000 µm
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, no-flat, notched
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 alumina, Borofloat (Schott), ceramic, Corning 1737, Foturan (Schott), gallium arsenide, Pyrex (Corning 7740), quartz (fused silica), silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
 200 .. 1000 µm