Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Contact flat alignment and exposure
Alignment tolerance
Registration of CAD data to features on wafer
 2 µm
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
 line
Field geometry
Shape of field with dimensions characterized by the maximum field size
 circle
Intensity
Intensity of light source
 20 mW/cm/cm
Magnification 1
Sides processed both
Wavelength
Wavelength of light used during the exposure
 365 .. 436 nm
Wafer size
Wafer size
Equipment Karl Suss MA6 Contact Aligner
Equipment characteristics:
Batch sizes 100 mm: 1, 150 mm: 1, 50 mm: 1, 75 mm: 1
Piece geometry
Geometry of wafer pieces the equipment can accept
 circular, rectangular
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
 metal chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 gallium arsenide, indium phosphide, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon carbide, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
 200 .. 800 µm
Comments: