Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  Titanium DC-magnetron sputtering
Process characteristics:
Thickness
Amount of material added to a wafer
Thickness*
Amount of material added to a wafer, must be 0.01 .. 0.2 µm
0.01 .. 0.2 µm
Ambient
Ambient to which substrate is exposed during processing
 argon
Deposition rate
Rate at which material is added to a wafer
 0.0144 µm/min
Material titanium
Pressure
Pressure of process chamber during processing
 5 mTorr
Sides processed either
Uniformity -0.05 .. 0.05
Wafer size
Wafer size
Equipment DC magnetron
Equipment characteristics:
Batch sizes 150 mm: 3
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 Pyrex (Corning 7740), quartz (single crystal), Borofloat (Schott), silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
 300 .. 1000 µm
Extra terms
No materials with Gold contamination will be processed at this fab site. Certain services (for example, oxidation, diffusion, and sputter deposition) will be provided if wafers are virgin, or all pre-processing steps have been performed at this fab site.