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MNX

Geometric metrology: Page 2 of 4

Process Hierarchy

  • Bonding
  • Clean
  • Consulting
  • Deposition
  • Doping
  • Etch
  • LIGA
  • Lift off
  • Lithography
  • Mask making
  • Metrology
  • Electrical metrology
  • Geometric metrology
  • Miscellaneous metrology
  • Miscellaneous
  • Packaging
  • Polishing
  • Process technologies
  • Thermal
  • Unique capabilities
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Process
Spectrophotometric film thickness measurement
Stylus profilometer 1-D step measurement
AFM (Atomic force microscopy)
Optical Microscopy
Optical surface profilometry
SEM sample analysis
Stylus profilometer step measurement
Wafer curvature measurement
Wafer curvature measurement (stress calculation)
Wafer curvature measurement (thermal expansion & biaxial modulus calculation)
SEM sample analysis
Spectrophotometric film thickness measurement
Microscope inspection
Spectrophotometric film thickness measurement #1
Spectrophotometric film thickness measurement #2
Spectroscopic ellipsometry film thickness measurement
Stylus profilometer step measurement
Wafer curvature measurement
Wafer curvature measurement with stress calculation
Spectrophotometric film thickness
Results Page:  1 2 3 4
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