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Advantages
Capabilities
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How to Start
About MEMS
Geometric metrology: Page 4 of 4
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Electrical metrology
Geometric metrology
Miscellaneous metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
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Process
Film thickness measurement (interferometry)
Line width measurement
Non-contact profilometry
Optical microscopy
SEM (Scanning Electron Microscopy)
STM (Scanning Tunneling Microscopy)
Stylus profilometry
Surface profilometry
Wafer curvature measurement
Wafer thickness measurement
Results Page:
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