Register or Sign in
  • Advantages
  • Capabilities
  • Company
  • How to Start
  • About MEMS
MNX

Thermal: Page 3 of 4

Process Hierarchy

  • Bonding
  • Clean
  • Consulting
  • Deposition
  • Doping
  • Etch
  • LIGA
  • Lift off
  • Lithography
  • Mask making
  • Metrology
  • Miscellaneous
  • Packaging
  • Polishing
  • Process technologies
  • Thermal
  • Anneal
  • Bake
  • Oxidation
  • Unique capabilities
per page
Process
Nitrogen anneal
Dry oxidation (metal)
Dry oxidation (non-metal)
Nitrogen anneal
Wet oxidation (metal)
Wet oxidation (non-metal)
Dehydration bake
G-line BCB cure
G-line photoresist bake (AZ4000)
G-line photoresist hardbake (AZ4000)
Nitrogen anneal (non-MOS-clean)
Rapid thermal anneal (argon)
Rapid thermal anneal (hydrogen/nitrogen)
Rapid thermal anneal (nitrogen)
Rapid thermal anneal (oxygen)
Dry oxidation
Dry/wet/dry TCA oxidation
Dry/wet/dry oxidation
Nitrogen anneal
Photoresist hardbake (hotplate @105C)
Results Page:  1 2 3 4
MNX HomeContactTerms of UseGallerySearchCatalogSign in